- Applied to selective soldering and desoldering of plated through holes components on printed circuit board assembly (PCBA) (e.g. DIP IC, connector);
- Solder path & heater made of SUS316L;
- Solder pot made of cast iron, good corrosion resistance;
- Applied to lead-free soldering;
- MCU digital temperature controller, the accuracy ±2°C, real-time temperature monitoring;
- Setting the cycle duration from wave rising to wave falling to protect component and board from damage;
- Setting the wave height and flow;
- With a safe circuit that the motor will not run if the temperature of the molten solder does not reach the setting; with over-temperature alarm; the control module and the heater module are standalone units, so the control module will not be affected by the high temperature of the heater;
- With laser positioner to indicate the soldering position;
- With an open worktable and antistatic bench mat, suited for large-sized PCBs (e.g. motherboard, communication board);
- Fast and uniform heating, solder melting for about 40 minutes, suited for multi-layer boards;
- Different flow wells for option, and special flow wells can be made in a variety of shapes to suit the individual requirements;
- With footswitch, easy to operate and control the time;
- PCB positioning device for option, easy to position PCB
Technical data
|
Model |
Smooth-200 |
|
Power requirements |
230V 50/60Hz ±10% |
|
Power consumption |
1700W |
|
PCB size (L × W) |
Max 600x600 mm |
|
Heater and material |
1600W:400WX4, SUS316 |
|
Power consumption for motor |
15W Brushless DC Motor |
|
Flow well size |
Maximum dimensions : L=180 mm |
|
Soldering temperature |
200°C-350°C |
|
Temperature fluctuations |
≤±5℃ |
|
Temperature control |
MCU control, SSR |
|
Heating rate |
Heating from room temperature (23-28℃) to 300 ℃, the heating time should be ≤40 minutes. |
|
Temperature show |
LCD, °C |
|
Adjustable crest height |
1.0-3.5mm |
|
Temperature control & display |
PLC + Touchscreen Control & Display |
|
Safety protection device |
Motor temperature locked and over temperature alarm |
|
Time setting |
1-60 sec |
|
Solder content |
Approx. 22kg |
|
Machine dimension (W × L × H) |
Solder pot: 340 ×430 ×180 mm Controller module: 340 × 230 ×180 mm |
|
Weight |
Solder bath section: Approximately 20kg (excluding solder) Control section: 9kg |
PCB positioning device (option)
Partial flow wells sizes
|
Specs |
External dimension mm |
Internal dimension mm |
Application |
|
ZN/B/L-16 |
13 x 25 |
11 x 23 |
14-16Pin IC |
|
ZN/ -20 |
13 x 30 |
11 x 28 |
18-20Pin IC |
|
ZN/ -28 |
21 x 40 |
19 x 38 |
24-28Pin IC |
|
ZN/ -34P |
8 x 47 |
6 x 45 |
Connector 34Pin |
|
ZN/ -40 |
8 x 54 |
6 x 52 |
Connector 40Pin |
|
ZN/ -42 |
21 x 60 |
19 x 58 |
36-42Pin IC |
|
ZN/ -50 |
8 x 67 |
6 x 65 |
Connector 50Pin |
|
ZN/ -60 |
60 x 60 |
58 x 58 |
Transformer and others |
|
ZN/ -64 |
25 x 65 |
23 x 63 |
54-64Pin IC |
|
ZN/ -100 |
20 x 100 |
18 x 98 |
Plug and others |
|
ZN/ -1040 |
12 x 42 |
10 x 40 |
Plug and others |
|
ZN-1050 |
12 x 52 |
10 x 50 |
Plug and others |
|
ZN-1080 |
12 x 82 |
10 x 80 |
Plug |
|
ZN-10100 |
12 x 102 |
10 x 100 |
Plug |
|
ZN-10130 |
12 x 132 |
10 x 130 |
Plug |
|
ZN-13100 |
15 x 102 |
13 x 100 |
Plug |
|
ZN-13120 |
15 x 122 |
13 x 120 |
Plug |
|
ZN-2525 |
27 x 27 |
25 x 25 |
PGA |
|
ZN-3030 |
32 x 32 |
30 x 30 |
PGA |
|
ZN-3535 |
37 x 37 |
35 x 35 |
PGA |
|
ZN-4040 |
42 x 42 |
40 x 40 |
PGA |
|
ZN- |
242 x 12 |
240 x 10 |
DIMM |
Special flow wells can be made in a variety of shapes to suit the individual requirements.
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